High-Temperature Vibration Sensor

High-Temperature Vibration Sensor

Reliable Performance in 175℃
3-axis Accelerometer
MCM(Multi-Chip Module) Process
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Description

ZITN VS175 175℃ 3-Axis High-Temperature Vibration Sensor is a new type of vibration sensor.The main circuit of ZITN VS175 175℃ 3-Axis High-Temperature Vibration Sensor adopts MCM technology, ensuring reliable product performance. The sensor uses an RS485 communication interface, which features strong anti-interference capability and supports bus connection. It can upload data to the main control circuit in real time.

 

Application

 

 

Logging fields such as petroleum, coal mining, and geology.

MWD Operation.

 

Product Features

 

 

  • High precision;
  • 3-axis accelerometer;
  • Compact structure, small size;
  • Vibration resistance and shock resistance.

 

Main Parameters

 

 

Serial Number

Item

Specification Value

1

Operating Temperature Range

0℃~175℃

2

Measurement Range

40g

3

Bandwidth

500Hz

4

Accuracy

±5%

5

Input Voltage

+4.9~+10V

6

Input Current

<30mA(@5V)

7

Communication Interface

RS485

8

Baud Rate

9600~460800bps

9

Storage Temperature Range

-40℃~+175℃

10

Shock

2000g

11

Size

92mm×27.5mm×12mm

 

High-Temperature MCM Solution

 

 

Traditional Plastic Encapsulation Device Solution vs ZITN High-Temperature MCM Packaging Solution

 

Comparison Dimension

Traditional Plastic Encapsulation Device Solution

ZITN High-Temperature MCM Packaging Solution

Solder Joint & Connection Stability

Many solder joints, all surface-mounted;

prone to cold solder/desoldering risks under high-temperature vibration, high failure rate.

Few solder joints, all through-hole soldered;

Reliable electrical connection under high-temperature vibration;

Low failure rate.

Encapsulation & Service Life

Chips are non-hermetically sealed;

susceptible to oxidation and corrosion, short service life.

Modules are hermetically sealed;

Isolated from oxygen and moisture;

Long service life.

Maintenance Convenience

Complex circuit structure and soldering method, not easy to maintain.

Modular design;

Simple repair and maintenance.

Confidentiality

Poor confidentiality, easy to crack and copy.

Good confidentiality, difficult to crack and copy.

 

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