ZITN LHP10 series Hybrid Integrated Circuit DC-DC Switching Power Supply Modules are manufactured using thick-film hybrid integrated circuit technology (MCM). They feature small size, compact structure, strong vibration resistance, high reliability, and excellent performance.
With a rated output power of 10W, they can support a DC voltage input range of 24V~72V. They are equipped with comprehensive protection functions, including input undervoltage protection, output overcurrent protection, output overvoltage protection, and output short-circuit protection, and adopt hexahedral shielding.
Product Features
- Operating Temperature (Case Temperature): -55℃ ~ +200℃;
- Input Voltage: 24 ~ 72V;
- Output Voltage: 3.3V, 5V, 9V, 12V, 15V, 18V, 24V (maximum 3 output channels);
- Output Ripple and Noise: 1% Vo;
- Output Power: 10W (75% of rated power provided when case temperature is 200℃).
Application
Downhole instruments for petroleum exploration.
Downhole instruments for petroleum drilling.
Downhole geophysical prospecting instruments.
Technical Features of ZT Hybrid Integrated Circuit DC-DC Switching Power Supply Module
Introduction to MCM Process
The high-temperature MCM (Multichip Module) thick-film hybrid integrated circuit fundamentally addresses three major quality risks encountered by measurement-while-drilling (MWD) instruments during operation from the perspectives of implementation principle and physical structure: high-temperature failure of electronic components, electrical connection failure, and insufficient shock resistance of circuits.
Advantages of ZT High-Temperature MCM Thick-Film Hybrid Integrated Circuit Compared with Traditional High-Temperature PCB Solutions
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Traditional Plastic-Encapsulated Device Solution |
ZT High-Temperature MCM Encapsulation Solution |
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Multiple surface-mounted solder joints; high risk of cold solder joints and detachment under high temperature & vibration, leading to high failure rate |
Fewer through-hole solder joints; reliable electrical connection under high temperature & vibration, low failure rate |
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Non-hermetic chip packaging; susceptible to oxidation and corrosion, short service life |
Hermetically sealed module; isolates oxygen and moisture, long service life |
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Complex circuit structure and welding method; difficult to maintain |
Modular design; easy maintenance |
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Poor confidentiality; vulnerable to cracking and counterfeiting |
High confidentiality; hard to crack and counterfeit |
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